Miramid® H3KC

Category: Nylon 6 , Polyamide 6
Manufacturer: BASF Leuna GmbH
Trademark: Miramid®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: 8S9buo_Miramid-H3KC.pdf
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Message
Miramid® H3KC is a Polyamide 6 (Nylon 6) material. It is available in Europe for injection molding.

Important attributes of Miramid® H3KC are:
  • Chemical Resistant
  • Crystalline
  • Fast Molding Cycle
  • Good Processability
  • Mold Release Agent

Typical applications include:
  • Automotive
  • Engineering/Industrial Parts
  • Electrical/Electronic Applications
  • Handles
General Information
Additive
  • Mold Release
Features
  • Crystalline
  • Fast Molding Cycle
  • Fuel Resistant
  • Good Flow
  • Good Moldability
  • Grease Resistant
  • Oil Resistant
  • Solvent Resistant
Uses
  • Automotive Interior Parts
  • Connectors
  • Engineering Parts
  • Handles
  • Thin-walled Parts
Forms
  • Granules
Processing Method
  • Injection Molding
Multi-Point Data
  • Creep Modulus vs. Time (ISO 11403-1)
  • Isochronous Stress vs. Strain (ISO 11403-1)
  • Isothermal Stress vs. Strain (ISO 11403-1)
  • Secant Modulus vs. Strain (ISO 11403-1)
  • Shear Modulus vs. Temperature (ISO 11403-1)
PhysicalDryConditionedUnitTest Method
Density 1130--kg/m³ISO 1183 1
Melt Volume-Flow Rate (MVR) (275°C/5.0 kg)160--cm³/10minISO 1133
Water Absorption ISO 62 2
     Saturation 9.0--%
     Equilibrium 2.5--%
Viscosity number 145--cm³/gISO 307, 1157, 1628 3
MechanicalDryConditionedUnitTest Method
Tensile modulus 34001200MPaISO 527-2 4
Tensile Stress (Yield)90.050.0MPaISO 527-2 5
Tensile Strain (Yield)4.020%ISO 527-2 6
Nominal Tensile Strain at Break 10> 50%ISO 527-2/50
Flexural Modulus 2700--MPaISO 178
ImpactDryConditionedUnitTest Method
Charpy notched impact strength ISO 179/1eA 7
     -30°C 4.50--kJ/m²
     23°C 5.0020.0kJ/m²
Charpy impact strength ISO 179/1eU 8
     -30°C No Break--
     23°C No BreakNo Break
ThermalDryConditionedUnitTest Method
Deflection Temperature Under Load ISO 75-2 9
     0.45 MPa 190--°C
     1.8 MPa 65.0--°C
Melting Temperature (DSC) 220--°CISO 3146
ElectricalDryConditionedUnitTest Method
Volume resistivity 1.0E+131.0E+10ohms·mIEC 60093 10
Dielectric Constant (1 MHz)3.406.00IEC 60250
Dissipation Factor (1 MHz)0.0150.25IEC 60250 11
Comparative tracking index 600--IEC 60112 12
InjectionDryUnit
Processing (Melt) Temp 240 to 270°C
Mold Temperature 80.0 to 120°C
Note Message
1 .Tested in accordance with ISO 10350. 23°C/50%r.h. unless otherwise noted.
2 .Tested in accordance with ISO 10350. 23°C/50%r.h. unless otherwise noted.
3 .Tested in accordance with ISO 10350. 23°C/50%r.h. unless otherwise noted.
4 .Tested in accordance with ISO 10350. 23°C/50%r.h. unless otherwise noted.
5 .Tested in accordance with ISO 10350. 23°C/50%r.h. unless otherwise noted.
6 .Tested in accordance with ISO 10350. 23°C/50%r.h. unless otherwise noted.
7 .Tested in accordance with ISO 10350. 23°C/50%r.h. unless otherwise noted.
8 .Tested in accordance with ISO 10350. 23°C/50%r.h. unless otherwise noted.
9 .Tested in accordance with ISO 10350. 23°C/50%r.h. unless otherwise noted.
10 .Tested in accordance with ISO 10350. 23°C/50%r.h. unless otherwise noted.
11 .Tested in accordance with ISO 10350. 23°C/50%r.h. unless otherwise noted.
12 .Tested in accordance with ISO 10350. 23°C/50%r.h. unless otherwise noted.
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