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EPO-TEK® H31D
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | 80xVmC_EPO-TEK-H31D.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| Message |
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| EPO-TEK® H31D is a single component, electrically conductive silver epoxy designed for die-bonding of semiconductors, including IC's, resistors, capacitors, transistors, and diodes which may be found in opto-electronics packaging or hybrid micro-electronics. |
| General Information | |
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| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Ion Type | |||
| Cl- | 19 | ppm | |
| K+ | 36 | ppm | |
| Na+ | 222 | ppm | |
| Particle Size | < 20.0 | µm |
| Additional Information | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Degradation Temperature | 350 | °C | TGA |
| Die Shear Strength - >5 kg (23°C) | 11.7 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 200 | °C | |
| Intermittent | -55 to 300 | °C | |
| Storage Modulus (23°C) | 6.25 | GPa | |
| Thixotropic Index | 3.90 | ||
| Weight Loss on Heating | |||
| 200°C | 0.080 | % | |
| 250°C | 0.18 | % | |
| 300°C | 0.43 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 110 | °C | |
| CLTE - Flow | |||
| -- 2 | 4.2E-5 | cm/cm/°C | |
| -- 3 | 1.8E-4 | cm/cm/°C | |
| Thermal Conductivity | 3.5 | W/m/K |
| Thermoset | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Shelf Life (-40°C) | 26 | wk |
| Uncured Properties | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Color | Silver | ||
| Density | 2.84 | g/cm³ | |
| Viscosity 4(23°C) | 40 to 70 | Pa·s | |
| Curing Time (150°C) | 1.0 | hr | |
| Pot Life 5 | 130000 | min |
| Cured Properties | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Shore Hardness (Shore D) | 85 | ||
| Lap Shear Strength (23°C) | 7.94 | MPa | |
| Volume Resistivity (23°C) | < 5.0E-4 | ohms·cm |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-250°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | 5 rpm |
| 5 . | Closed Container |
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