| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Cytec Industries Inc. |
| Trademark: | CYCOM® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | 7oGZmU_CYCOM-5320-1.pdf |
| PRICE: | Order Products email sales@su-jiao.com |
| Message |
|---|
|
CYCOM® 5320-1 is a toughened epoxy resin prepreg system designed for out-of-autoclave manufacturing of primary structural applications. Because of its lower temperature curing capability, it is also suitable for prototyping where low cost tooling or vacuum-bag-only curing is required. CYCOM 5320-1 handles like standard prepreg, yet can be vacuum bag cured to produce autoclave quality parts having very low porosity. It offers mechanical properties equivalent to other 350°F (177°C) autoclave-cured toughened epoxy prepreg systems after a 350°F (177°C) freestanding postcure. |
| General Information | |
|---|---|
| Uses |
|
| Forms |
|
| Processing Method |
|
| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Specific Gravity | 1.31 | g/cm³ |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| RTP 2283 LF | RTP Company | PEEK | RTP |
| Monprene® OM-10240-01 | Teknor Apex Company | TPE | Monprene® |
| Geon™ Vinyl Packaging XPL 355GC | PolyOne Corporation | PVC, Rigid | Geon™ Vinyl Packaging |
| Elastron® G G100.A80.N.E | Elastron USA, Inc. | SEBS | Elastron® G |
| Leona™ 91G60 | Asahi Kasei Chemicals Corporation | Nylon 66 | Leona™ |