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EPO-TEK® P10
| Category: | PI, TS , Thermoset Polyimide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | 6lsbCq_EPO-TEK-P10.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| A single component, modified polyimide, high-temperature grade, silver-filled, electrically and thermally conductive adhesive designed for semiconductor die attach and hybrid microelectronic packaging. |
| General Information | |
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| Filler / Reinforcement |
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| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Ion Type | |||
| Cl- | 224 | ppm | |
| K+ | 37 | ppm | |
| Na+ | 75 | ppm | |
| NH4+ | 28 | ppm | |
| Particle Size | < 20.0 | µm |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Degradation Temperature | 331 | °C | |
| Die Shear Strength - >5 kg (23°C) | 11.7 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 200 | °C | |
| Intermittent | -55 to 300 | °C | |
| Storage Modulus (23°C) | 2.81 | GPa | |
| Thixotropic Index | 3.60 | ||
| Weight Loss on Heating | |||
| 200°C | < 0.050 | % | |
| 250°C | < 0.050 | % | |
| 300°C | 0.090 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 100 | °C | |
| CLTE - Flow | |||
| -- 2 | 3.3E-5 | cm/cm/°C | |
| -- 3 | 1.2E-4 | cm/cm/°C | |
| Thermal Conductivity | 7.9 | W/m/K |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Shelf Life (23°C) | 52 | wk | |
| Post Cure Time (285°C) | 1.5 | hr |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Color | Silver | ||
| Density | 2.48 | g/cm³ | |
| Viscosity 4(23°C) | 9.0 to 15 | Pa·s | |
| Curing Time | |||
| 80°C 5 | < 0.50 | hr | |
| 150°C | 1.0 | hr |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Shore Hardness (Shore D) | 73 | ||
| Volume Resistivity (23°C) | < 5.0E-3 | ohms·cm |
| Note Message | |
|---|---|
| 1 . | Ramp 40°C/Min to 300°C |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | 20 rpm |
| 5 . | Pre-Bake |
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| Advanced Composites ATX832D | Advanced Composites, Inc. | TPO | Advanced Composites |
| Elastron® G G500.A75.N.PS | Elastron USA, Inc. | SEBS | Elastron® G |
