Order Products : sales@su-jiao.com
EPO-TEK® H70E-175
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | 6f5r6K_EPO-TEK-H70E-175.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
Wechat:
| Message |
|---|
| EPO-TEK® H70E-175 is a two component, thermally conductive, electrically insulating epoxy adhesive for semiconductor, microelectronic and opto-electronic packaging. It may be used in aluminum heat sinking power devices in the form of hybrid circuits or at the SMD/PCB level. |
| General Information | |
|---|---|
| Features |
|
| Uses |
|
| Agency Ratings |
|
| RoHS Compliance |
|
| Forms |
|
| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Particle Size | < 20.0 | µm |
| Additional Information | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Degradation Temperature | 392 | °C | TGA |
| Die Shear Strength - >4 kg (23°C) | 9.38 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 200 | °C | |
| Intermittent | -55 to 300 | °C | |
| Storage Modulus (23°C) | 5.22 | GPa | |
| Thixotropic Index | 2.55 | ||
| Weight Loss on Heating | |||
| 200°C | 0.59 | % | |
| 250°C | 1.4 | % | |
| 300°C | 3.3 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 70.0 | °C | |
| CLTE - Flow | |||
| -- 2 | 2.6E-5 | cm/cm/°C | |
| -- 3 | 8.4E-5 | cm/cm/°C | |
| Thermal Conductivity | 0.32 | W/m/K |
| Thermoset | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Thermoset Components | |||
| Part A | Mix Ratio by Weight: 1.0 | ||
| Part B | Mix Ratio by Weight: 1.0 | ||
| Shelf Life (23°C) | 52 | wk |
| Uncured Properties | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Color | |||
| -- 4 | Grey | ||
| -- 5 | Grey | ||
| Density | |||
| Part A | 1.36 | g/cm³ | |
| Part B | 1.92 | g/cm³ | |
| Viscosity 6(23°C) | 5.0 to 11 | Pa·s | |
| Curing Time (180°C) | 1.0 | hr | |
| Pot Life | 2900 | min |
| Cured Properties | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Shore Hardness (Shore D) | 88 | ||
| Lap Shear Strength (23°C) | > 13.8 | MPa | |
| Relative Permittivity (1 kHz) | 4.72 | ||
| Volume Resistivity (23°C) | 2.0E+13 | ohms·cm |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | Part B |
| 5 . | Part A |
| 6 . | 20 rpm |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| RTP 1400 GB 30 | RTP Company | PESU | RTP |
| Trademark PP PPR3500MA | Trademark Plastics Corporation | PP Random Copolymer | Trademark PP |
| Expandable PS MP42W | INEOS Styrenics International SA | PS (EPS) | Expandable PS |
| DIAMALOY ENGINEERED ALLOYS TPE/ABS ST4600 | Network Polymers, Inc. | TPE Alloy | DIAMALOY ENGINEERED ALLOYS |
| LUVOCOM® 1-1120/BN | Lehmann & Voss & Co. | Nylon 66 | LUVOCOM® |
