EPO-TEK® H35-175MPLV

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Epoxy Technology Inc.
Trademark: EPO-TEK®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: 6YHssU_EPO-TEK-H35-175MPLV.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
Wechat: WECHAT
Message
EPO-TEK® H35-175MPLV is a single component, silver-filled epoxy for military hybrid die and component attach. It is a lower viscosity version of EPO-TEK® H35-175MP.
General Information
Filler / Reinforcement
  • Silver
Features
  • Electrically Conductive
  • Low to No Outgassing
  • Thermally Conductive
Uses
  • Adhesives
  • Electrical/Electronic Applications
  • Military Applications
Agency Ratings
  • EC 1907/2006 (REACH)
  • EU 2003/11/EC
  • EU 2006/122/EC
  • MIL Std. 883
RoHS Compliance
  • RoHS Compliant
Forms
  • Paste
PhysicalNominal ValueUnit
Ion Type
    Cl- < 200ppm
    K+ < 50ppm
    Na+ < 50ppm
    NH4+ 65ppm
Particle Size < 20.0µm
Additional InformationNominal ValueUnitTest Method
Degradation Temperature 330°CTGA
Die Shear Strength - >10 kg (23°C) 23.4MPa
Operating Temperature
    Continuous -55 to 180°C
    Intermittent -55 to 280°C
Storage Modulus (23°C) 3.41GPa
Thixotropic Index 2.66
Weight Loss on Heating
    200°C 0.040%
    250°C 0.060%
    300°C 0.19%
ThermalNominal ValueUnit
Glass Transition Temperature 1> 100°C
CLTE - Flow
    -- 24.7E-5cm/cm/°C
    -- 31.9E-4cm/cm/°C
Thermal Conductivity 1.5W/m/K
ThermosetNominal ValueUnitTest Method
Shelf Life (-40°C)52wk
Uncured PropertiesNominal ValueUnitTest Method
Color Silver
Density 2.64g/cm³
Viscosity 4(23°C)11 to 17Pa·s
Curing Time (180°C)1.0hr
Pot Life 40000min
Cured PropertiesNominal ValueUnitTest Method
Shore Hardness (Shore D)75
Lap Shear Strength (23°C)12.9MPa
Volume Resistivity (23°C)< 5.0E-4ohms·cm
Note Message
1 .Dynamic Cure 20-300°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min
2 .Below Tg
3 .Above Tg
4 .10 rpm
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