| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | 68funV_EPO-TEK-H37-MPT.pdf |
| PRICE: | Order Products email sales@su-jiao.com |
| Message |
|---|
| A single component, silver-filled and electrically conductive adhesive designed for semiconductor die attach and bonding SMDs for hybrid microelectronic packaging. It is certified and lot accepted to the requirements of MIL-STD 883/Test Method 5011. It can be used for opto-packaging including LEDs, laser and photo-diodes, and fiber optic circuit assembly. |
| General Information | |
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| Filler / Reinforcement |
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| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Ion Type | |||
| Cl- | < 200 | ppm | |
| K+ | < 50 | ppm | |
| Na+ | < 50 | ppm | |
| NH4+ | 53 | ppm | |
| Particle Size | < 20.0 | µm |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Degradation Temperature | 350 | °C | |
| Die Shear Strength - >10 kg (23°C) | 23.4 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 200 | °C | |
| Intermittent | -55 to 300 | °C | |
| Storage Modulus (23°C) | 3.72 | GPa | |
| Weight Loss on Heating (200°C) | 0.010 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 90.0 | °C | |
| CLTE - Flow | |||
| -- 2 | 4.4E-5 | cm/cm/°C | |
| -- 3 | 1.1E-4 | cm/cm/°C | |
| Thermal Conductivity | 2.8 | W/m/K |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Shelf Life (-40°C) | 52 | wk |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Color | Silver | ||
| Density | 3.36 | g/cm³ | |
| Viscosity 4(23°C) | 80 to 110 | Pa·s | |
| Curing Time (150°C) | 1.0 | hr | |
| Pot Life | 40000 | min |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Shore Hardness (Shore D) | 76 | ||
| Lap Shear Strength (23°C) | 11.7 | MPa | |
| Volume Resistivity (23°C) | < 5.0E-4 | ohms·cm |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | 2.5 rpm |
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|---|---|---|---|
| Taitacell EPS 391S | Taita Chemical Company, Ltd. | PS (EPS) | Taitacell |
| BJB Polyurethane TC-895 A/B | BJB Enterprises, Inc. | PUR, Unspecified | BJB Polyurethane |
| INSTRUC PCGF30 | Infinity LTL Engineered Compounds | PC | INSTRUC |
| Sylvin 802-88 White 1523 | Sylvin Technologies Incorporated | PVC, Unspecified | Sylvin |
| Sylvin 9790-60 Green 3205 | Sylvin Technologies Incorporated | PVC, Unspecified | Sylvin |