EPO-TEK® H37-MPT

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Epoxy Technology Inc.
Trademark: EPO-TEK®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: 68funV_EPO-TEK-H37-MPT.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
Wechat: WECHAT
Message
A single component, silver-filled and electrically conductive adhesive designed for semiconductor die attach and bonding SMDs for hybrid microelectronic packaging. It is certified and lot accepted to the requirements of MIL-STD 883/Test Method 5011. It can be used for opto-packaging including LEDs, laser and photo-diodes, and fiber optic circuit assembly.
General Information
Filler / Reinforcement
  • Silver
Features
  • Electrically Conductive
  • Thixotropic
Uses
  • Adhesives
  • Bonding
  • Electrical/Electronic Applications
  • LEDs
Agency Ratings
  • EC 1907/2006 (REACH)
  • EU 2003/11/EC
  • EU 2006/122/EC
  • MIL Std. 883
RoHS Compliance
  • RoHS Compliant
Forms
  • Paste
PhysicalNominal ValueUnit
Ion Type
    Cl- < 200ppm
    K+ < 50ppm
    Na+ < 50ppm
    NH4+ 53ppm
Particle Size < 20.0µm
Additional InformationNominal ValueUnit
Degradation Temperature 350°C
Die Shear Strength - >10 kg (23°C) 23.4MPa
Operating Temperature
    Continuous -55 to 200°C
    Intermittent -55 to 300°C
Storage Modulus (23°C) 3.72GPa
Weight Loss on Heating (200°C) 0.010%
ThermalNominal ValueUnit
Glass Transition Temperature 1> 90.0°C
CLTE - Flow
    -- 24.4E-5cm/cm/°C
    -- 31.1E-4cm/cm/°C
Thermal Conductivity 2.8W/m/K
ThermosetNominal ValueUnit
Shelf Life (-40°C)52wk
Uncured PropertiesNominal ValueUnit
Color Silver
Density 3.36g/cm³
Viscosity 4(23°C)80 to 110Pa·s
Curing Time (150°C)1.0hr
Pot Life 40000min
Cured PropertiesNominal ValueUnit
Shore Hardness (Shore D)76
Lap Shear Strength (23°C)11.7MPa
Volume Resistivity (23°C)< 5.0E-4ohms·cm
Note Message
1 .Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min
2 .Below Tg
3 .Above Tg
4 .2.5 rpm
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