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NuSil CF20-2186

Category:	Silicone , Silicone
Manufacturer:	NuSil Technology
Trademark:	NuSil
Fillers:	-
Ports:	Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms	FOB, CIF, DAP, DAT, DDP
PDF:	66rVgF_NuSil-CF20-2186.pdf
PRICE:	Order Products email sales@su-jiao.com

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Message
As a low stress alternative for electronic packaging, NuSil Technology's silicones allow the designer to choose from a unique line of silicones for various levels of packaging. We have an extensive line of encapsulants, adhesives, and greases to choose from. These include thermally and electrically conductive silicones for Thermal Interface Materials (TIM) or for EMI and RFI shielding applications. Benefits of Silicone for Electronics: Wide Operating Temperature Range of -115 °C to 250 °C Low moisture absorption, < 0.4% Typical Corrosion Resistance High Dielectric Strength > 500 V/mil (0.001 inch) or 20 kV/mm Fillers can be added to provide thermal and electrical conductive properties Low Modulus (Typically less than 5.5 MPa/800 psi) Stable chemical and mechanical properties when exposed to high temperatures Low Shrinkage Available as gels, elastomers, film adhesives sheeting, and greases General Purpose: Adhesives and Sealants Comments: Longer Work Time

Message

As a low stress alternative for electronic packaging, NuSil Technology's silicones allow the designer to choose from a unique line of silicones for various levels of packaging. We have an extensive line of encapsulants, adhesives, and greases to choose from. These include thermally and electrically conductive silicones for Thermal Interface Materials (TIM) or for EMI and RFI shielding applications.

Benefits of Silicone for Electronics:

Wide Operating Temperature Range of -115 °C to 250 °C

Low moisture absorption, < 0.4% Typical

Corrosion Resistance

High Dielectric Strength > 500 V/mil (0.001 inch) or 20 kV/mm

Fillers can be added to provide thermal and electrical conductive properties

Low Modulus (Typically less than 5.5 MPa/800 psi)

Stable chemical and mechanical properties when exposed to high temperatures

Low Shrinkage

Available as gels, elastomers, film adhesives sheeting, and greases

General Purpose: Adhesives and Sealants

Comments: Longer Work Time

General Information
Features	Good Corrosion Resistance Good Thermal Stability Low Moisture Absorption Low Shrinkage
Uses	Adhesives Electrical/Electronic Applications Sealants

Thermoset	Nominal Value	Unit
Thermoset Components
Part A	Mix Ratio by Weight: 1.0
Part B	Mix Ratio by Weight: 1.0

Additional Information	Nominal Value	Unit
Cure System	Platinum
Operating Temperature	-65 to 240	°C

Uncured Properties	Nominal Value	Unit
Color	Translucent
Density	1.10	g/cm³
Viscosity
-- ¹	50	Pa·s
-- ²	80	Pa·s
Curing Time (100°C)	1.0	hr
Pot Life	180	min

Cured Properties	Nominal Value	Unit
Shore Hardness (Shore A)	30
Tensile Strength	7.58	MPa
Tensile Elongation at Break	600	%
Tear Strength	14.0	kN/m
Electric Strength	35	kV/mm

Note Message
1 .	Part B
2 .	Part A

Resin Grade	Manufacturer	Category	Trademark
Shinko-Lac® ABS 3001MH	Mitsubishi Rayon America Inc.	ABS	Shinko-Lac®
Adell Polyamide AR-17	Adell Plastics, Inc.	Nylon 66	Adell Polyamide
Celstran® PP-GF30-02 AD 3019	Celanese Corporation	PP, Unspecified	Celstran®
HiFill® PA6/6 GF30 IM HS L	Techmer Engineered Solutions	Nylon 66	HiFill®
LEXAN™ BFL4000U resin	SABIC Innovative Plastics	PC	LEXAN™