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MTM® 249
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Cytec Industries Inc. |
| Trademark: | MTM® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | 4g7VIT_MTM-249.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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MTM249 is a tough and dual-cure temperature prepreg matrix formulated for the manufacture of structural components operating at temperatures up to 200°C (392°F). MTM249 will cure at 135°C (275°F) and provide excellent mechanical performance for components operating up to 140°C (284°F). A 180°C (356°F) cure will increase the service temperature to 180°C (356°F) whilst retaining a high level of toughness. Maximum service temperature is 200°C (392°F) after a 200°C (392°F) post-cure. |
| General Information | |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Specific Gravity 1 | 1.20 | g/cm³ |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature | |||
| -- 2 | 140 | °C | |
| -- 3 | 203 | °C |
| Note Message | |
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| 1 . | Cured resin |
| 2 . | DMA E' onset Tg, 3 hours at 135°C (275°F), dry |
| 3 . | DMA E' onset Tg, 3 hours at 135°C (275°F), dry + 2 hour at 200°C (392°F), dry |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| RTP 199 X 106955 | RTP Company | PP, Unspecified | RTP |
| NEXT REPROCESSED PC/ABS 830-300R | NEXT Specialty Resins, Inc. | PC+ABS | NEXT REPROCESSED |
| LG ABS XR409E | LG Chem Ltd. | ABS | LG ABS |
| PEXTIN™ PBTG15-BK10 | Pier One Polymers, Inc. | PBT | PEXTIN™ |
| Fortron® 1115E7 | Celanese Corporation | PPS | Fortron® |
