Vyncolit® E 8940SG

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Vyncolit N.V.
Trademark: Vyncolit®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: 4KQGvB_Vyncolit-E-8940SG.pdf
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E 8940SG is a mineral reinforced epoxy molding compound, formulated for the encapsulation of electronic devices requiring high quality, exceptional reliability, and outstanding moldability. Typical applications include passive electronics, RC networks and rectifiers.
General Information
Filler / Reinforcement
  • Mineral filler
Features
  • The degassing effect is low to no
  • Low viscosity
  • Solvent resistance
  • Anti-salt water/fog
  • Good formability
  • Good thermal shock resistance
  • Good chemical resistance
  • alkali resistance
  • acid resistance
  • Non-corrosive
Uses
  • Electrical components
  • Military application
Agency Ratings
  • FDA not rated
  • USDA Unspecified Approval
Appearance
  • Black
Forms
  • Particles
Processing Method
  • Resin transfer molding
  • Compression molding
  • Injection molding
PhysicalNominal ValueUnitTest Method
Specific Gravity 1.80g/cm³ASTM D792
Molding Shrinkage - Flow (Compression Molded)0.30 - 0.50%ASTM D955
MechanicalNominal ValueUnitTest Method
Tensile Strength (Break, Compression Molded)86.0MPaASTM D638
Flexural Modulus (Compression Molded)15200MPaASTM D790
Flexural Strength (Break)120MPaASTM D790
Compressive Strength 240MPaASTM D695
ImpactNominal ValueUnitTest Method
Notched Izod Impact (Compression Molded)19J/mASTM D256
ThermalNominal ValueUnitTest Method
Deflection Temperature Under Load (1.8 MPa, Unannealed, Compression Molded)225°CASTM D648
CLTE - Flow 2.2E-5cm/cm/°CASTM E831
Thermal Conductivity 0.72W/m/KASTM C177
ElectricalNominal ValueUnitTest Method
Dielectric Strength 114kV/mmASTM D149
Dielectric Constant (1 MHz)3.00ASTM D150
Dissipation Factor (1 MHz)6.0E-3ASTM D150
InjectionNominal ValueUnit
Middle Temperature 60.0 - 82.2°C
Nozzle Temperature 82.2 - 93.3°C
Processing (Melt) Temp 104 - 116°C
Mold Temperature 135 - 177°C
Injection Pressure 34.5 - 68.9MPa
Holding Pressure 13.8 - 34.5MPa
Back Pressure 0.345MPa
Injection instructions
Gauge: 0.3The value listed as Thermal Conductivity, ASTM C177, was tested in accordance with ASTM C518.Powder Density, ASTM D1895: 0.8 g/cm³Water Absorption, ASTM D570, 48 hrs, 50°C: 0.1%DTUL @264psi - Unannealed, ASTM D648, Post Baked, Compression Molded: 225°CDielectric Strength, ASTM D149, 60 Hz, Method B, dry: 14.4 kV/mmDielectric Constant, ASTM D150, 1000000 Hz, dry: 3Dissipation Factor, ASTM D150, 1000000 Hz, dry: 0.006Compression and Transfer Molding Conditions: Preheat Temperature: 180 to 220 °F Mold Temperature: 250 to 530 °F Compression Mold Pressure: 200 to 1500 psi Transfer Mold Pressure: 100 to 2000 psi Cure Time, 0.125 in: 75 sec
Note Message
1 .Method B (step by step)
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