Category: | Epoxy , Epoxy; Epoxide |
Manufacturer: | Vyncolit N.V. |
Trademark: | Vyncolit® |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | 4KQGvB_Vyncolit-E-8940SG.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
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E 8940SG is a mineral reinforced epoxy molding compound, formulated for the encapsulation of electronic devices requiring high quality, exceptional reliability, and outstanding moldability. Typical applications include passive electronics, RC networks and rectifiers. |
General Information | |
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Features |
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Agency Ratings |
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Processing Method |
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Physical | Nominal Value | Unit | Test Method |
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Specific Gravity | 1.80 | g/cm³ | ASTM D792 |
Molding Shrinkage - Flow (Compression Molded) | 0.30 - 0.50 | % | ASTM D955 |
Mechanical | Nominal Value | Unit | Test Method |
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Tensile Strength (Break, Compression Molded) | 86.0 | MPa | ASTM D638 |
Flexural Modulus (Compression Molded) | 15200 | MPa | ASTM D790 |
Flexural Strength (Break) | 120 | MPa | ASTM D790 |
Compressive Strength | 240 | MPa | ASTM D695 |
Impact | Nominal Value | Unit | Test Method |
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Notched Izod Impact (Compression Molded) | 19 | J/m | ASTM D256 |
Thermal | Nominal Value | Unit | Test Method |
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Deflection Temperature Under Load (1.8 MPa, Unannealed, Compression Molded) | 225 | °C | ASTM D648 |
CLTE - Flow | 2.2E-5 | cm/cm/°C | ASTM E831 |
Thermal Conductivity | 0.72 | W/m/K | ASTM C177 |
Electrical | Nominal Value | Unit | Test Method |
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Dielectric Strength 1 | 14 | kV/mm | ASTM D149 |
Dielectric Constant (1 MHz) | 3.00 | ASTM D150 | |
Dissipation Factor (1 MHz) | 6.0E-3 | ASTM D150 |
Injection | Nominal Value | Unit | |
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Middle Temperature | 60.0 - 82.2 | °C | |
Nozzle Temperature | 82.2 - 93.3 | °C | |
Processing (Melt) Temp | 104 - 116 | °C | |
Mold Temperature | 135 - 177 | °C | |
Injection Pressure | 34.5 - 68.9 | MPa | |
Holding Pressure | 13.8 - 34.5 | MPa | |
Back Pressure | 0.345 | MPa |
Injection instructions |
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Gauge: 0.3The value listed as Thermal Conductivity, ASTM C177, was tested in accordance with ASTM C518.Powder Density, ASTM D1895: 0.8 g/cm³Water Absorption, ASTM D570, 48 hrs, 50°C: 0.1%DTUL @264psi - Unannealed, ASTM D648, Post Baked, Compression Molded: 225°CDielectric Strength, ASTM D149, 60 Hz, Method B, dry: 14.4 kV/mmDielectric Constant, ASTM D150, 1000000 Hz, dry: 3Dissipation Factor, ASTM D150, 1000000 Hz, dry: 0.006Compression and Transfer Molding Conditions: Preheat Temperature: 180 to 220 °F Mold Temperature: 250 to 530 °F Compression Mold Pressure: 200 to 1500 psi Transfer Mold Pressure: 100 to 2000 psi Cure Time, 0.125 in: 75 sec |
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1 . | Method B (step by step) |
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