Category: | Epoxy , Epoxy; Epoxide |
Manufacturer: | Epoxy Technology Inc. |
Trademark: | EPO-TEK® |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | 3dOGMc_EPO-TEK-H67MP-GB.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
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A single component, thermally conductive, electrically insulating epoxy designed to meet the requirements of MIL-STD-883/Test Method 5011 for hybrid microelectronic packaging and assemblies. It maybe used for bonding SMDs, die-attach, substrate-attach or general heat sinking. It is a version of EPO-TEK® H67MP which contains 2 mil glass beads. |
General Information | |
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Features |
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Uses |
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Agency Ratings |
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RoHS Compliance |
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Forms |
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Physical | Nominal Value | Unit | |
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Ion Type | |||
Cl- | < 200 | ppm | |
K+ | < 50 | ppm | |
Na+ | < 50 | ppm | |
NH4+ | 44 | ppm | |
Particle Size | < 55.0 | µm |
Additional Information | Nominal Value | Unit | |
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Degradation Temperature | 360 | °C | |
Operating Temperature | |||
Continuous | -55 to 200 | °C | |
Intermittent | -55 to 300 | °C | |
Storage Modulus (23°C) | 5.88 | GPa | |
Weight Loss on Heating | |||
200°C | 0.29 | % | |
250°C | 0.79 | % | |
300°C | 1.6 | % |
Thermal | Nominal Value | Unit | |
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Glass Transition Temperature | 93.0 | °C | |
CLTE - Flow | |||
-- 1 | 1.7E-5 | cm/cm/°C | |
-- 2 | 7.5E-5 | cm/cm/°C | |
Thermal Conductivity | 0.43 | W/m/K |
Thermoset | Nominal Value | Unit | |
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Shelf Life (-40°C) | 52 | wk |
Uncured Properties | Nominal Value | Unit | |
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Color | White | ||
Density | 2.00 | g/cm³ | |
Viscosity 3(23°C) | 330 | Pa·s | |
Curing Time (150°C) | 1.0 | hr | |
Pot Life | 40000 | min |
Cured Properties | Nominal Value | Unit | |
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Shore Hardness (Shore D) | 86 | ||
Lap Shear Strength (23°C) | > 13.8 | MPa | |
Relative Permittivity (1 kHz) | 5.01 | ||
Volume Resistivity (23°C) | 2.0E+13 | ohms·cm | |
Dissipation Factor (1 kHz) | 4.5E-3 |
Note Message | |
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1 . | Below Tg |
2 . | Above Tg |
3 . | 1 rpm |
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