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Arlon® 25FR
| Category: | PTFE , Polytetrafluoroethylene |
| Manufacturer: | Arlon-MED |
| Trademark: | Arlon® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | 3GXZyM_Arlon-25FR.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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Arlon 25N and 25FR are woven fiberglass reinforced, ceramic-filled composite materials engineered for use in microwave and RF multilayer printed circuit boards. Combining a non-polar thermoset resin system with a controlled-expansion ceramic filler, 25N and 25FR offer low dielectric constant and loss combined with a low Thermal Coefficient of Dielectric Constant (TCEr) for signal stability over a wide ambient temperature range. Designed for use in multilayer packages, 25N and 25FR offer prepregs that are identical in chemical composition and physical properties with their copper clad laminates for a completely homogeneous finished package for optimal signal integrity. The low dielectric constant (Er) and loss properties, low thermal coefficient of dielectric constant (TCEr), and excellent physical stability characteristics offered by 25N and 25FR materials make them ideal for wireless and digital applications, such as cellular telephones, down converters, low noise amplifiers, antennas and other advanced des ign circuits. Processing for 25N and 25FR materials is consistent with processing for standard high temperature thermoset based printed circuit board substrates. |
| General Information | |
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| Filler / Reinforcement |
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| Features |
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| Uses |
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| UL File Number |
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| Forms |
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| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Specific Gravity 1 | 1.80 | g/cm³ | ASTM D792A |
| Water Absorption 2(23°C, 24 hr) | 0.090 | % | Internal Method |
| Volatile Matter 3 | 0.0 | % |
| Films | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Peel Strength 4 | 875.6 | N/m | Internal Method |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Total Mass Loss 5(125°C) | > 0.24 | % | |
| Water Vapor - Recovered | 0.070 | % |
| Mechanical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Flexural Strength (23°C) | 241 | MPa | ASTM D790A |
| Films | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Tensile Strength - MD 6(Yield) | 96.5 | MPa | ASTM D882A |
| Thermal | Nominal Value | Unit | Test Method |
|---|---|---|---|
| CLTE - Flow | Internal Method | ||
| -- 7 | 1.6E-5 | cm/cm/°C | |
| -- 8 | 1.8E-5 | cm/cm/°C | |
| -- 9 | 5.9E-5 | cm/cm/°C | |
| -10 to 140°C 10 | 5.0E-5 | cm/cm/°C | |
| Thermal Conductivity (100°C) | 0.45 | W/m/K | ASTM E1225 |
| Electrical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Surface Resistivity (0.305 mm) | 8.9E+8 | ohms | Internal Method |
| Volume Resistivity (0.305 mm) | 4.2E+8 | ohms·cm | Internal Method |
| Dielectric Constant 11(23°C, 10.0 GHz) | 3.58 | Internal Method | |
| Dissipation Factor 12(10.0 GHz) | 3.5E-3 | Internal Method |
| Flammability | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Flame Rating 13 | V-0 | UL 94 |
| Note Message | |
|---|---|
| 1 . | 23°C |
| 2 . | E1/105 + D24/23 |
| 3 . | Maximum 0.10% |
| 4 . | After Thermal Stress |
| 5 . | < 10e-6 torr, Maximum 1.00% |
| 6 . | 23°C |
| 7 . | X-axis |
| 8 . | Y-axis |
| 9 . | Z-axis |
| 10 . | Adapted |
| 11 . | C23/50 |
| 12 . | C23/50 |
| 13 . | C48/23/50, E24/125, |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| TAFMER™ A-20090 | Mitsui Chemicals America, Inc. | PAO | TAFMER™ |
| GELOY™ XP4045LG resin | SABIC Innovative Plastics | ASA+PC | GELOY™ |
| Iupilon® MB1700 | Mitsubishi Engineering-Plastics Corp | PC+ABS | Iupilon® |
| Maxxam™ X MX5200-8054 FR NC001 | PolyOne Corporation | PP, Unspecified | Maxxam™ |
| POCAN® B 3233 HR 000000 | LANXESS GmbH | PBT | POCAN® |
