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EVICOM™ RG7/915
| Category: | PVC, Rigid , Rigid Polyvinyl Chloride |
| Manufacturer: | INEOS Compounds |
| Trademark: | EVICOM™ |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | 2Wlb6L_EVICOM-RG7-915.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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The values listed for Tensile Modulus were tested at an unspecified rating. The values listed for Coefficient of Thermal Expansion were tested at an unspecified rating. The values listed for Thermal Conductivity were tested at an unspecified rating. |
| General Information | |
|---|---|
| Forms |
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| Processing Method |
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| Hardness | Nominal Value | Test Method | |
|---|---|---|---|
| Rockwell Hardness (R-Scale) | 115 | ASTM D785 |
| Mechanical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Tensile Modulus (23°C) | 2.80 | MPa | ASTM D638 |
| Thermal | Nominal Value | Unit | Test Method |
|---|---|---|---|
| CLTE - Flow | 6.0E-5 | cm/cm/°C | ASTM D696 |
| Thermal Conductivity | 0.16 | W/m/K | ASTM C177 |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| NYCOA Polyamide 4230 HST | Nycoa (Nylon Corporation of America) | Nylon 6 | NYCOA Polyamide |
| K-Prene INSULATION EPR 5082 | Technovinyl Polymers India Ltd. | MPR | K-Prene |
| Infino GW-1041 | SAMSUNG SDI CO., LTD. | PC+ABS | Infino |
| SECCO LL0220KJ | Shanghai SECCO Petrochemical Co., Ltd | LLDPE | SECCO |
| LEXAN™ XHT1141 resin | SABIC Innovative Plastics | PC | LEXAN™ |
