Devcon 2 Ton® Epoxy

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Devcon
Trademark: Devcon
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: 24nGNe_Devcon-2-Ton-Epoxy.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
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Message
Extremely strong, medium-cure, water-resistant clear adhesive that will self-level after application.

Intended Use:
  • Bonding parts in a structural environment or potting electronic components and assemblies

Product features:
  • Cures without shrinking
  • Cures at room temperature
  • Good impact resistance
  • Produces strong, rigid bond on metal, ceramics, wood, concrete, glass, or combinations
General Information
Features
  • Rigidity, high
  • High strength
  • Impact resistance, good
  • Low shrinkage
Uses
  • Electrical/Electronic Applications
  • Bonding
Appearance
  • Clear/transparent
Processing Method
  • potting
PhysicalNominal ValueUnitTest Method
Specific Volume 0.910cm³/g
Solid content- by Volume 100%
ImpactNominal ValueUnitTest Method
Impact Resistance 13.7kJ/m²
ThermalNominal ValueUnit
Service Temperature - Dry -40 - 93°C
ThermosetNominal ValueUnitTest Method
Work Time 8.0 - 12.0min
Additional InformationNominal ValueUnitTest Method
Tensile Shear Adhesion 15.5MPaASTM D1002
PhysicalNominal ValueUnitTest Method
Density 11.10g/cm³
HardnessNominal ValueUnitTest Method
Durometer Hardness (Shore D)83ASTM D2240
MechanicalNominal ValueUnitTest Method
Tensile Elongation (Break)1.0%
Compressive Strength 75.8MPaASTM D695
ElectricalNominal ValueUnitTest Method
Dielectric Strength 24kV/mmASTM D149
ThermosetNominal ValueUnitTest Method
Thermoset Components
    Component a Mixing ratio by weight: 1.2 Mixing ratio by capacity: 1.0
    Component B Mixing ratio by weight: 1.0 Mixing ratio by capacity: 1.0
Thermoset Mix Viscosity 8000cP
Additional InformationNominal ValueUnitTest Method
Cured 7 days @ 75°F
Uncured PropertiesNominal ValueUnitTest Method
Curing Time 16hr
Note Message
1 .Mixed
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