Category: | Epoxy , Epoxy; Epoxide |
Manufacturer: | Epoxy Technology Inc. |
Trademark: | EPO-TEK® |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | 1son8x_EPO-TEK-E3001-HV.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
Message |
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EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. |
General Information | |
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Filler / Reinforcement |
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Features |
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Uses |
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Agency Ratings |
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RoHS Compliance |
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Forms |
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Physical | Nominal Value | Unit | |
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Ion Type | |||
Cl- | 125 | ppm | |
K+ | 4 | ppm | |
Na+ | 6 | ppm | |
NH4+ | 27 | ppm | |
Particle Size | < 20.0 | µm |
Additional Information | Nominal Value | Unit | Test Method |
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Degradation Temperature | 435 | °C | TGA |
Die Shear Strength - >10 kg (23°C) | 23.4 | MPa | |
Operating Temperature | |||
Continuous | -55 to 200 | °C | |
Intermittent | -55 to 300 | °C | |
Storage Modulus (23°C) | 2.15 | GPa | |
Thixotropic Index | 3.90 | ||
Weight Loss on Heating (300°C) | 0.23 | % |
Thermal | Nominal Value | Unit | |
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Glass Transition Temperature 1 | > 100 | °C | |
CLTE - Flow | |||
-- 2 | 2.4E-5 | cm/cm/°C | |
-- 3 | 7.7E-5 | cm/cm/°C | |
Thermal Conductivity | 1.1 | W/m/K |
Thermoset | Nominal Value | Unit | Test Method |
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Shelf Life (-40°C) | 52 | wk |
Uncured Properties | Nominal Value | Unit | Test Method |
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Color | Silver | ||
Density | 2.83 | g/cm³ | |
Viscosity 4(23°C) | 11 to 14 | Pa·s | |
Curing Time (150°C) | 1.0 | hr | |
Pot Life | 1400 | min |
Cured Properties | Nominal Value | Unit | Test Method |
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Shore Hardness (Shore D) | 80 | ||
Lap Shear Strength (23°C) | 10.3 | MPa | |
Volume Resistivity (23°C) | < 5.0E-4 | ohms·cm |
Note Message | |
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1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
2 . | Below Tg |
3 . | Above Tg |
4 . | 20 rpm |
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