KYOCERA KE-G200V

Category: Epoxy , Epoxy; Epoxide
Manufacturer: KYOCERA Chemical Corporation
Trademark: KYOCERA
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: 1o0hgs_KYOCERA-KE-G200V.pdf
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High Reliable and Easy-to-Use Molding Compounds for Various Type of Packages

Strong Points
  • Provide Various Molding Compounds with High Reliability to Cover Many Applications such as LSI, Transistors and Diodes.
  • Good Curability and Applicable to Various Molding Machines (Both Automated and Conventional)
  • Low Stress of Large chips and Applicable to Encapsulation.

Application
Smaller SOP, Smaller QFP, DIP, SIP/ZIP, TO-PKG, DPAK, SOT, Unbalanced PKG, Module
General Information
Uses
  • Electrical/Electronic Applications
PhysicalNominal ValueUnit
Specific Gravity 2.00g/cm³
Spiral Flow 95.0cm
MechanicalNominal ValueUnit
Flexural Modulus 22000MPa
Flexural Strength 160MPa
ThermalNominal ValueUnit
Glass Transition Temperature 150°C
CLTE - Flow
    -- 11.0E-5cm/cm/°C
    -- 24.2E-5cm/cm/°C
Uncured PropertiesNominal ValueUnit
Gel Time 0.45min
Note Message
1 .Alpha 1
2 .Alpha 2
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