KYOCERA KE-G1200

Category: Epoxy , Epoxy; Epoxide
Manufacturer: KYOCERA Chemical Corporation
Trademark: KYOCERA
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: 1VGACz_KYOCERA-KE-G1200.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
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Special Epoxy Molding Compounds Optimizing Warpage and Applicable to Fine Pitch Wire for BGA Package

Strong Points
  • Less Warpage in All Types of Area Array Packages due to High Tg Characteristic.
  • Applicable to Fine Pitch Wire Bonding with Good Wire Sweep Performance.
  • Achieve High Yield after Molding due to Excellent Moldability that allows its application to MAP.

Application
  • Standard P-BGA, HS-BGA and LGA Package.
  • Multi Chip Module (Stacked or Side by Side Layout)
  • IC Card, Memory Card etc.

Low Alpha Ray Type: KE-G2200
General Information
Features
  • Good Moldability
Uses
  • Electrical/Electronic Applications
PhysicalNominal ValueUnit
Specific Gravity 2.00g/cm³
Spiral Flow 140cm
Solution Viscosity 9000mPa·s
MechanicalNominal ValueUnit
Flexural Modulus 27000MPa
Flexural Strength 180MPa
ThermalNominal ValueUnit
Glass Transition Temperature 180°C
CLTE - Flow
    -- 18.0E-6cm/cm/°C
    -- 22.7E-5cm/cm/°C
Note Message
1 .Alpha 1
2 .Alpha 2
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