EPO-TEK® 920-FL

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Epoxy Technology Inc.
Trademark: EPO-TEK®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: 0qB4SU_EPO-TEK-920-FL.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
Wechat: WECHAT
Message
EPO-TEK® 920-FL is a two component, high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It is a low viscosity version of EPO-TEK® 920.
General Information
Features
  • Electrically Insulating
  • Good Adhesion
  • Low Viscosity
  • Thermally Conductive
Uses
  • Adhesives
  • Electrical/Electronic Applications
  • Optical Applications
  • Printed Circuit Boards
  • Seals
Agency Ratings
  • EC 1907/2006 (REACH)
  • EU 2003/11/EC
  • EU 2006/122/EC
RoHS Compliance
  • RoHS Compliant
Forms
  • Paste
Processing Method
  • Casting
  • Potting
PhysicalNominal ValueUnit
Particle Size < 50.0µm
Additional InformationNominal ValueUnitTest Method
Degradation Temperature 362°CTGA
Die Shear Strength - >20 kg (23°C) 46.9MPa
Operating Temperature
    Continuous -55 to 200°C
    Intermittent -55 to 300°C
Storage Modulus (23°C) 5.40GPa
Thixotropic Index 3.10
Weight Loss on Heating
    200°C 0.20%
    250°C 0.28%
    300°C 0.48%
ThermalNominal ValueUnit
Glass Transition Temperature 1> 90.0°C
CLTE - Flow
    -- 22.1E-5cm/cm/°C
    -- 39.7E-5cm/cm/°C
Thermal Conductivity 0.89W/m/K
ThermosetNominal ValueUnitTest Method
Thermoset Components
    Part A Mix Ratio by Weight: 100
    Part B Mix Ratio by Weight: 3.0
Shelf Life (23°C)52wk
Uncured PropertiesNominal ValueUnitTest Method
Color
    -- 4Amber
    -- 5Grey
Density
    Part B 1.02g/cm³
    Part A 2.51g/cm³
Viscosity 6(23°C)8.0 to 12Pa·s
Curing Time (150°C)1.0hr
Pot Life 420min
Cured PropertiesNominal ValueUnitTest Method
Shore Hardness (Shore D)93
Lap Shear Strength (23°C)> 13.8MPa
Relative Permittivity (1 kHz)5.96
Volume Resistivity (23°C)> 4.0E+13ohms·cm
Dissipation Factor (1 kHz)9.0E-3
Note Message
1 .Dynamic Cure 20-200°C/ISO 25 Min; Ramp -40-200°C @ 20°C/Min
2 .Below Tg
3 .Above Tg
4 .Part B
5 .Part A
6 .20 rpm
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