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EPO-TEK® GE116
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | 0P1rTP_EPO-TEK-GE116.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| A single component, thixotropic, electrically and thermally insulating epoxy adhesive designed for bonding SMDs to the PCB. It can be used for electronic assembly in many devices including consumer electronics, cell phone, telecommunications, medical, automotive, and scientific/OEM. It is a red color version of EPO-TEK® 115-SMT. |
| General Information | |
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| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Particle Size | < 20.0 | µm |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Degradation Temperature | 344 | °C | |
| Die Shear Strength - >5 kg (23°C) | 11.7 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 175 | °C | |
| Intermittent | -55 to 275 | °C | |
| Storage Modulus (23°C) | 3.02 | GPa | |
| Weight Loss on Heating | |||
| 200°C | 0.27 | % | |
| 250°C | 1.1 | % | |
| 300°C | 3.0 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 65.0 | °C | |
| CLTE - Flow | |||
| -- 2 | 4.1E-5 | cm/cm/°C | |
| -- 3 | 2.2E-4 | cm/cm/°C |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Shelf Life (-40°C) | 52 | wk |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Color | Red | ||
| Density | 1.15 | g/cm³ | |
| Viscosity 4(23°C) | 200 to 300 | Pa·s | |
| Curing Time (150°C) | 1.0 | hr | |
| Pot Life | 40000 | min |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Shore Hardness (Shore D) | 80 | ||
| Lap Shear Strength (23°C) | 10.8 | MPa | |
| Relative Permittivity (1 kHz) | 3.48 | ||
| Volume Resistivity (23°C) | > 7.0E+13 | ohms·cm | |
| Dissipation Factor (1 kHz) | 7.0E-3 |
| Note Message | |
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| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | 1 rpm |
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