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EPO-TEK® H20E-MP
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | 0EkKxk_EPO-TEK-H20E-MP.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| Message |
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| EPO-TEK® H20E-MP is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. It has proven itself to be extremely reliable over many years of service and is still the conductive adhesive of choice for new applications. Also available in a single component frozen syringe. |
| General Information | |
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| Filler / Reinforcement |
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| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Ion Type | |||
| Cl- | < 200 | ppm | |
| K+ | < 50 | ppm | |
| Na+ | < 50 | ppm | |
| NH4+ | 126 | ppm | |
| Particle Size | < 45.0 | µm |
| Additional Information | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Degradation Temperature | 425 | °C | TGA |
| Die Shear Strength - >10 kg (23°C) | 23.4 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 200 | °C | |
| Intermittent | -55 to 300 | °C | |
| Storage Modulus (23°C) | 5.58 | GPa | |
| Thixotropic Index | 4.63 | ||
| Weight Loss on Heating | |||
| 200°C | 0.59 | % | |
| 250°C | 1.1 | % | |
| 300°C | 1.7 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 80.0 | °C | |
| CLTE - Flow | |||
| -- 2 | 3.1E-5 | cm/cm/°C | |
| -- 3 | 1.6E-4 | cm/cm/°C | |
| Thermal Conductivity | |||
| -- 4 | 2.5 | W/m/K | |
| -- 5 | 29 | W/m/K |
| Thermoset | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Thermoset Components | |||
| Part A | Mix Ratio by Weight: 1.0 | ||
| Part B | Mix Ratio by Weight: 1.0 | ||
| Shelf Life (23°C) | 26 | wk |
| Uncured Properties | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Color | |||
| -- 6 | Silver | ||
| -- 7 | Silver | ||
| Density | |||
| Part A | 2.02 | g/cm³ | |
| Part B | 3.06 | g/cm³ | |
| Viscosity 8(23°C) | 2.2 to 3.2 | Pa·s | |
| Curing Time (150°C) | 1.0 | hr | |
| Pot Life | 2900 | min |
| Cured Properties | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Shore Hardness (Shore D) | 75 | ||
| Lap Shear Strength (23°C) | 10.2 | MPa | |
| Volume Resistivity (23°C) | < 4.0E-4 | ohms·cm |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | Based on standard method: Laser Flash |
| 5 . | Based on Thermal Resistance Data: R = L x K^-1 x A^-1 |
| 6 . | Part B |
| 7 . | Part A |
| 8 . | 100 rpm |
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|---|---|---|---|
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